Key breakthrough for electronic packaging

Key development in semiconductor technology provides breakthrough in electronic packaging

Key development in semiconductor technology provides breakthrough for electronic packaging

Semiconductor Research Corporation & Stanford Develop Unique Combination of Elements for Thermal Nanotape That Transforms Packaging Applications
Semiconductor Research Corporation (SRC), the world’s leading university-research consortium for semiconductors and related technologies, and researchers from Stanford University have developed a novel combination of elements that yields a unique nanostructure material for packaging. This advance should allow longer life for semiconductor devices while costing less than current state-of-the-art materials. In addition to chip manufacturers, several other industries could also gain greater product efficiencies from related thermal energy management technology.
For semiconductors, the improvement will come in the form of packaging for devices. Presently, manufacturers must rely on tiny pins or thick solder to bond sections of the semiconductor in order for the device to perform. However, current solder materials tend to degrade and fail due to heat and mechanical stress. In order to continue the scaling of integrated circuits, SRC and Stanford have researched materials that provide a high thermal connectivity — comparable to copper — with the flexible compliance of foam. The answer has been created through a nanostructured thermal tape that conducts heat like a metal while allowing the neighboring materials to expand and contract with temperature changes (metals are too stiff to allow this). This ability to reduce chip temperatures while remaining compliant is a key breakthrough for electronic packaging.

Checkout the full story @ Nanowerk News:

You can read more Design Cognition related packaging stories in Technology

Chris Penfold


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